Wang, Yongfeng is the Boya Distinguished Professor in the School of Electronics. He obtained his B.Sc. and Ph.D. from Peking University in 2001 and 2006, respectively. His research interests include single molecule electronics, organic spintronic, and self-assembly.

Dr. Wang has published more than fifty research papers, including one on Nature Chemistry, six on Journal of the American Chemical Society, three on ACS Nano and three on Physical Review Letters. He is in the Editorial Board of Acta Physico-Chimica Sinica.

Dr. Wang has seven research projects including NSFC and 973 programs. His research achievements are summarized as follows:

1) Single molecule electronic: One major research topic in single molecule electronic is to understand the relation between transport properties and molecule-electrode structures. We present STM measurements of the conductance of SnPc adsorbed on an Ag (111) surface and contacted by a Ag-covered W tip. By systematically manipulating the chemical bonding between SnPc and Ag (111) through selective dehydrogenation of SnPc together with an atomic-scale structuring of the Ag(111) electrode, Orders-of-magnitude variations of the single-molecule junction conductance were achieved

2) Organic spintronic: One topic in this field is to detect and manipulate molecular magnetic properties. In dense arrays, single ReA molecules are switched to a number of states, three of which carry a localized spin as evidenced by conductance spectroscopy in high magnetic fields. The spin of a single molecule may be reversibly switched on and off without affecting its neighbors. We suggest that ReA on Au is readily converted to a radical by the abstraction of an electron.

3) Self-assembly: A fractal is exactly the same at every scale or nearly the same at different scales. We succeeded in fabricating a whole series of molecularly assembled and defect-free STs by using a 120° backbone of the molecular building block, weak intermolecular interactions, a symmetry match between the substrate and the assembled STs, a moderate molecule-substrate interaction, a suitable temperature window, a low coverage and a slow cooling rate during the assembling process.